Requisition ID: R10163635

Category:

Engineering

Location:

Baltimore, Maryland, United States of America

Clearance Type:

None

Telecommute:

No - Teleworking not available for this position

Shift:

1st Shift (United States of America)

Travel Required:

No

Relocation Assistance:

Relocation assistance may be available

Positions Available:

1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman's Manufacturing Operations Engineering organization is seeking a Principal Microelectronics Manufacturing Engineer.

The Microelectronics Manufacturing Process Engineer responsibilities include, but are not limited to, the tasks outlined below:

Stencil/Fuzion/SPI/Wafer Handler

Developing a new Fuzion SC auto pick and place system and bringing equipment online for production

Developing a new MPM Stencil Printer and Cyberoptics Solder Paste Inspection system and bringing these online for production

Supporting engineering and early-phase production programming and development efforts through stencil printing, SPI, and auto pick and place processing once equipment is online

Creating and managing to project plans (tasks, resources, schedules) for process development activities and/or R&D projects

Overseeing Capital projects for new equipment, including specifying, identifying, and procuring of equipment, management of facilities upgrades installations, and preparing equipment for production

Developing and optimizing process parameters

Developing/revising process documentation and work instructions

Assisting with design of custom tooling

Design Support

Recommending product design improvements required to produce Advanced Packaging microelectronics products

Documenting state-of-the-art process capabilities and guidelines for product designers

Participating in design producibility reviews for new products

Basic Qualifications for a Principal Engineer:

Bachelor of Science degree or higher in Engineering or related STEM degree, with a minimum of 5 years of relevant work experience (3 years with a Masters)

Manufacturing/Process Engineering experience

Fluency in MS Office software applications

US Citizenship is required.

Preferred Qualifications:

Familiarity with J-STD and MIL-STD hardware requirements

Familiarity with Design of Experiments methodology

Knowledge of Geometric Dimensioning and Tolerancing (GD&T)

Experience with Lean/Six Sigma process improvement

Experience with the design or manufacturing of microelectronics technology and materials

CCA/PCB manufacturing experience

Salary Range:

$102,400 - $153,600

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.

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